GIGABYTE is redefining next-generation PC performance by unlocking the full potential of AMD Ryzen™ 9000 Series processors with AMD 3D V-Cache™ technology. At the centre of this breakthrough is X3D Turbo Mode 2.0, GIGABYTE’s exclusive, AI-powered performance optimisation technology that delivers real-time, adaptive tuning designed specifically for X3D-enabled CPUs.
Built as a seamless hardware–software fusion, X3D Turbo Mode 2.0 leverages massive real-world datasets and AI training to intelligently adjust system performance on the fly. Fully optimised and ready from day one, the technology enables Ryzen™ 9000 Series X3D processors to go beyond traditional performance limits without compromising stability, efficiency, or reliability.
Unlike static overclocking profiles, X3D Turbo Mode 2.0 dynamically adapts to workload demands in real time, maximising the benefits of AMD’s 3D V-Cache architecture. Whether gaming, content creation, or running intensive AI workloads, the system continuously fine-tunes performance to deliver smoother gameplay, faster responsiveness, and optimal power efficiency.
This intelligent approach allows users to extract maximum performance from X3D processors while maintaining thermal balance and long-term system stability, making it ideal for both enthusiasts and professionals.
GIGABYTE’s showcase is the X870E AORUS XTREME X3D AI TOP, a flagship motherboard engineered for users who demand uncompromising performance. Designed to exploit the capabilities of Ryzen™ 9000 Series X3D processors fully, the motherboard supports DDR5 memory speeds up to 9000+ MT/s, delivering exceptional bandwidth and stability for high-performance computing.
Its advanced thermal design ensures consistent performance even under extreme workloads. The CPU Thermal Matrix reduces VRM and DDR temperatures by up to 8.5°C, while DDR Wind Blade XTREME lowers memory module temperatures by up to 9°C. To maintain storage reliability, the M.2 Thermal Guard XTREME reduces SSD temperatures by up to 22°C, ensuring sustained speed and endurance during intensive tasks.
Beyond raw performance, GIGABYTE is expanding its X3D motherboard lineup with designs that balance aesthetics and usability. The X870E AERO X3D WOOD introduces a distinctive, natural look with warm wood-grain textures, refined leather pull tabs, and detailed craftsmanship, bringing a modern yet organic aesthetic to PC builds.
Responding to community feedback, GIGABYTE also expands its PROJECT STEALTH series with sleek black editions of the X870 and B850 AORUS STEALTH motherboards. Featuring a reverse-connector layout, these boards hide cables behind the motherboard tray, delivering a clean, cable-free appearance and a simplified building experience for gamers and creators alike.
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