GIGABYTE TECHNOLOGY Co. Ltd, a global leader in high-performance computing, has unveiled its next-generation flagship motherboard, the X870E AORUS XTREME X3D AI TOP, marking a new era of innovation, speed, and AI-driven performance. First introduced at GIGABYTE EVENT 2025, this cutting-edge platform is the world’s first motherboard designed exclusively for AMD Ryzen™ X3D processors, featuring GIGABYTE X3D Turbo Mode 2.0, support for DDR5 memory speeds up to 9000+ MT/s, and an array of smart thermal and user-friendly features built for enthusiasts and creators alike.
At the heart of this motherboard lies X3D Turbo Mode 2.0, an advanced AI overclocking engine trained on extensive big data. It automatically fine-tunes each chip for optimal performance, balancing frequency, power, and thermals. The result: up to 25% faster gaming performance and 14% improved multitasking productivity, all without manual tweaking. With GIGABYTE’s adaptive intelligence, Ryzen™ X3D processors now reach new heights in efficiency and performance.
Premium Power and Flagship Cooling
Engineered for serious performance, the X870E AORUS XTREME X3D AI TOP supports AMD Ryzen™ 9000, 8000, and 7000 Series CPUs. Its 24+2+2 phase (SPS 110A) VRM design easily powers the top-tier Ryzen™ 9 9950X3D, delivering uncompromised stability.
To keep that power cool, GIGABYTE employs an exclusive CPU Thermal Matrix that distributes heat evenly, lowering temperatures in the VRM and DDR regions. The DDR Wind Blade XTREME airflow system, M.2 Thermal Guard XTREME with a built-in fan and heat fins, and massive Fins Array heatsinks work together to maintain optimal cooling and long-term reliability.
Smarter Memory and Effortless Overclocking
Meet D5 Bionic Corsa, GIGABYTE’s AI-assisted memory optimiser that redefines DDR5 overclocking.
Reaching speeds of over 9000+ MT/s, this one-click solution delivers stable, blazing-fast performance with zero guesswork.
Seamless Connectivity and EZ-DIY Innovation
The X870E AORUS XTREME X3D AI TOP is built for convenience and future readiness. Its new DriverBIOS feature integrates Wi-Fi drivers directly into the BIOS, offering instant wireless setup right out of the box. The expanded 64MB BIOS capacity doubles the firmware space for more sophisticated features and updates.
DIY builders will love the lineup of EZ-DIY tools, including M.2 EZ-Match, EZ-Flex, PCIe EZ-Latch Plus Duo, Wi-Fi EZ-Plug, and the EZ-Debug Zone, making installation faster, cleaner, and frustration-free. For connectivity, it offers PCIe Gen5 x16 slots, Gen5 M.2 SSD support, Dual 10G LAN, and Wi-Fi 7 (320MHz) for ultimate speed and versatility. GIGABYTE also debuts a directional high-gain antenna with ARGB lighting, merging performance with visual flair.
Finally, the X870E AORUS XTREME X3D AI TOP isn’t just about power; it’s about experience. Its premium unboxing presentation is filled with exclusive surprises, underscoring GIGABYTE’s dedication to craftsmanship and excellence.
With its AI-driven optimisation, elite cooling design, and next-gen connectivity, the X870E AORUS XTREME X3D AI TOP stands as GIGABYTE’s most advanced and refined motherboard to date, setting the gold standard for the Ryzen™ X3D era.
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