GIGABYTE Technology, a global leader in motherboards, graphics cards, and high-performance hardware solutions, has announced the launch of its latest AMD Socket AM5 motherboard – the X870E AORUS X3D series. Engineered with next-generation architecture and AI-driven innovation, this flagship platform sets a new benchmark for PC enthusiasts, gamers, and professionals seeking uncompromising performance and reliability.
AI-Powered Performance Breakthrough
At the core of the X870E AORUS X3D is X3D Turbo Mode 2.0, an AI-powered performance engine that dynamically optimises gaming workloads in real time. Leveraging GIGABYTE’s proprietary built-in AI model, it can deliver up to a 25% boost in gaming performance, adapting seamlessly to different usage scenarios for both play and productivity.
Memory performance reaches unprecedented heights with D5 Bionic Corsa technology, an AI-enhanced system that pushes DDR5 speeds to an extraordinary 9000 MT/s.
Through intelligent analysis and parameter adjustments across hardware, software, and firmware, this innovation ensures both peak performance and rock-solid stability.
Further enhancing data integrity, GIGABYTE employs PCB Back Drilling Technology on an advanced 8-layer PCB design. This precision manufacturing method reduces signal reflections, minimises timing issues, and improves electromagnetic resistance, ensuring cleaner and more reliable performance even under extreme conditions.
Power delivery is handled by an 18+2+2 phase VRM solution, designed to unleash the full capabilities of AMD Ryzen™ 9000, 8000, and 7000 series processors, guaranteeing clean, stable energy across demanding workloads.
Advanced Thermal Design
The X870E AORUS X3D introduces a comprehensive thermal management system to ensure sustained peak performance.
VRM Thermal Armour Advanced with direct-touch heatpipes cools critical power zones, while the PCB Thermal Plate improves thermal efficiency by 14% and reinforces overall stability. The M.2 EZ-Flex cooling system, with its patented flexible baseplate, ensures optimal SSD heat dissipation regardless of configuration.
Redefining the Build Experience
Designed with user convenience in mind, the X870E AORUS X3D series introduces several installation-friendly innovations:
● DriverBIOS with pre-installed Wi-Fi drivers ensures instant network access on first boot.
● PCIe EZ-Latch Plus Duo provides a screwless, one-click release system for dual PCIe slots.
● Rear EZ-Button relocates essential functions—Power, Reset, Clear CMOS, and Q-Flash+—to the rear I/O panel for easy access during setup and troubleshooting.
● Wi-Fi EZ-Plug simplifies antenna installation with a secure, tool-free design.
UC BIOS 2.0: Smarter System Control
The revamped UC BIOS 2.0 revolutionises BIOS interaction with features such as one-click screenshot capture, quick return-to-home navigation, and a built-in search bar for locating settings instantly.
In addition, Smart 80 Port Diagnostics blends POST code monitoring with real-time thermal insights, giving users an unprecedented level of system visibility.
Next-Generation Connectivity
GIGABYTE ensures that connectivity keeps pace with innovation. The X870E AORUS X3D includes dual USB4 Type-C ports with DisplayPort Alt Mode, front-panel Quick Charge USB with 65W power delivery, HDMI output, and high-speed LAN with 10GbE + 5GbE ports.
Wireless performance is equally future-ready with Wi-Fi 7, paired with a directional ultra-high-gain antenna for stable, long-range connectivity.
With its blend of AI intelligence, engineering precision, and user-first design, the X870E AORUS X3D motherboard embodies GIGABYTE’s commitment to redefining what’s possible in PC hardware.
The series is now available worldwide through authorised retailers.
For more details, visit GIGABYTE’s official website.
